Relifie RL-044 Chip Reballing Template for A19 iPhone 17 BGA Soldering

Description:
The relife RL-044 is a precise TIN planting or reballing template for mobile chips and professional micro-work. It was developed for use in repair shops and technicians that are reliant for chip repairs on accurate hole positions and clean soldering points.

The templates are checked for measurement on the original device and on the basis of the factory drawings to ensure high accuracy of fit and reliable processing in fine chip work.

Highlights:
🔧 specifically designed for chip reballing and tin-planting with mobile devices
📍 Precise round and angular hole positions for clean, uniform solder balls
🧩 Tested by original dimensions and factory drawings for high accuracy
🔥 High quality special steel with good heat resistance
⚙️ uniform heat distribution for clean TIN planting results
📏 Ultr-thin design for better fit while working
💪 High toughness with good flexural strength in the daily workshop insert

Technical data:

• Model: RELIFE RL-044
• Type: Chip Reballing / Tin-Planting Tin Steel Stencil Set
• Suitable for: A19 / iPhone 17
• Material: high quality special steel
• Features: Ultrathin, heat resistant, fatigue resistant, precise hole positions
• Application: Reballing / Tin-Planting from Mobile Phone Chips

Application / applications:
Suitable for iPhone and smartphone motherboard repair, chip-reballing, microlönons and professional workshop work in the mobile phone repair area.

Delivery:
1 x Relife RL-044 Chip Reballing Template