Kaisi KS-303Pro | Heating plate for printed circuit boards | Intelligent disassembly unit for iPhone ICS

Description:
The Kaisi KS-303pro is a smart heating and disassembly unit for professional work on smartphone motherboards and IC components. It enables the processing of various iPhone and Android main boards without the heating module must be changed with each model.

The integrated high-temperature heating plate ensures targeted warming of the motherboard and supports technicians with IC disassembly, soldering and other motherboard repairs.

Highlights:
🔥 Heater for professional motherboard and IC repairs
📱 Supports different iPhone and Android motherboards
🔧 Suitable for IC disassembly, soldering and motherboard editing
♨️ High temperature heating source for controlled heating
🔄 No more frequent change of heating module required for different smartphone models
🛡️ high temperature insulating plate between housing and heating plate
⚙️ Center mounted heating plate for stable working conditions
🛠️ Ideal for microloes workstations and professional repair shops

Technical data:

• Brand: Kaisi
• Model: KS-303PRO
• Product Type: PCB Heating Plate / IC Disassembly Unit
• Heating system: high temperature heating source with heating plate
• Insulation: high temperature insulating plate
• Application: Smartphone mainboards and IC repair

Compatible models:

• iPhone 4 series
• iPhone 5 series
• iPhone 6 series
• iPhone 7 series
• iPhone 8 series
• iphone x
• iphone xr
• iPhone XS
• iphone xs max
• Various Android smartphones

Application / applications:
Suitable for smartphone motherboard repair, IC disassembly, preheating printed circuit boards, microlölen and other work on electronic components. Ideal for mobile phone repair workshops, technicians and professional motherboard repair places.

Delivery:
1 x KAISI KS-303PRO Circuit board heating plate