Relifie RL-601T 31-in-1 Reballing Set | iPhone X-17 Pro Max Middle Layer Board Plant Tin Platform with 3D BGA Templates

Product description:
The RELIFE RL-601T REBALLING SET (31-IN-1) is a highly professional tool for the CPU and Middle Layer Board Repair of iPhone X to 17 per max.
With the 3d BGA-reballing template and the stable Plans-tin-platform enables precise, efficient and secure Tin plants, reballing and IC chip repairs On motherboards.

The magnetic fixation ensures one Stable and accurate positioningwhile the high quality stencils for uniform solder beads and provide a professional work result.

Key features:
🔧 31-in-1 complete set - For iPhone X to 17 Pro Max Motherboards
🧲 Magnetic fixation - Stable positioning, no slipping
🎯 3D BGA REBALLING Template - Perfect orientation for clean tin planting
⚡ High precision - uniform, round solder beads without residues
🔥 Heat-resistant construction - Durable and suitable for continuous use
📱 Universally applicable - Covers the common iPhone models from X to 17 PRO max

👉 with the RELIFE RL-601T 31-IN-1 REBALLING SET Do you have the perfect professional tool for the iPhone motherboard repair - From CPU-IC to Middle Layer Board. Ideal for mobile phone repair shops, service workshops and ambitious professionals.

Attention !!!
Please use only with expertise! We assume no liability for damages that arise under the application on the terminal!

Delivery: 1 x RELIFE RL-601T