Kaisi 0.12 mm BGA REBALLING Template Soldering Template for iPhone IC CPU (A-10) | 7 / 7P

1. Professional Tool for Mobile Phones Repairing.

2. Suitable for iPhone 7 Plus / 7.

3. The Unique Holes Design Makes It Easier to Take Out The Formed Solder Balls.

4. This stencil is easy to use no matter you are a new or expert.

5th Special Design Enables Stencil to Align With Tinning Position of CPU Rapidly.

6. Better Fit of Planting Tin. Smooth Hole Wall, No Residue After Tin, One-Time Shaping Of Planing Bal.

7. Professional tool for repairing mobile phones.

8. Suitable for iPhone 7 Plus / 7.

9. Special hole design facilitates the removal of the shaped solder balls.

10. This template is easy to handle - both for beginners and experts.

11. The special design allows quick orientation of the template to the zipper position of the CPU.

12. Optimal fit when applying the lot; Smooth perforated walls, no residues after tinning, precise forming of solder balls in one operation.

13. High-precision CNC laser technology, exact square holes with rounded corners and precise hole spacing design.

14. Ultrathin design, durable and wear resistant, extremely robust and flexible.

15. Made of special steel, high temperature resistant and dimensionally stable.