Kaisi 0.12 mm BGA Reballing Template for iPhone IC / CPU (A-11 | XS / XR / XS Max

1. Professional tool for repairing mobile phones.

2. Suitable for iPhone X / 8/8 Plus.

3. The special hole design facilitates the removal of the shaped solder balls.

4. This template is easy to handle - both for beginners and experts.

5. The special design allows a quick orientation of the template to the zipper position of the CPU.

6. Optimal fit when applying the lot; Smooth hole walls, no residues after tinning, precise shaping of solder balls in one operation.

7. High speed CNC laser technology, precisely rounded corners of square openings and exact hole distances.

8th ultrathin design; Durable, wear resistant, sturdy and flexible.

9. Made of special steel; High temperature resistant and dimensionally stable.