Kaisi 0.12 mm BGA Reballing Template for iPhone IC / CPU (A-13) | XS / XR / XS Max

1. Professional tool for repairing mobile phones.

2. Suitable for iPhone 11/11 Pro / 11 Pro max.

3. The special hole design facilitates the removal of the shaped solder balls.

4. This template is easy to handle - both for beginners and experts.

5. The special design allows a quick orientation of the template to the zipper position of the CPU.

6. Optimal fit when applying the lot; Smooth perforated walls, no residues after tinning, precise forming of solder balls in one operation.

7. High-speed CNC laser technology, precisely rounded corners of square holes and exact hole spacing.

8. Ultrathin design, durable and wear resistant, extremely robust and flexible.

9. Made of special steel, high temperature resistant and dimensionally stable.